Ausgabe 08/2010

Latest News / Exhibitions

Lead-free - Objectively Viewed 

Design

European Research Project for Green Electronics Using Nanotechnology 
(H. Poschmann) 

Integrative Development of Spatial Electronics and Embedded Components in Printed Circuit Boards 

Zuken Presents Stress-Free Migration to PADS from CADSTAR 

Coming-up: Optical Signal Transmission in Cellphones 

Yokowo Develops Wireless Voltage Sources 

Toshiba Develops 3-D FPGA 

Bauelemente

Gold-Cobalt High-performance Electrolyte for Depositing Hard Gold Coatings: Part 1 
(O. Kurtz et al) 
 (Größe: 115 KB)

4th Plug-Connector Applications Conference - Users Meet Producers 

Sensor +Test 2010-Focus on Energy Efficiency 

Printed Circuit Board Technologies

A Comparison of Thermal Properties of Various Insulated Metal-Substrate Printed Circuit Boards 
(Frank Amrhein et al) 
 (Größe: 122 KB)

Electroless Deposition of Nickel-Phosphorus High-Thickness Composite Coatings 
(M. Petrova et al) 

Technolam: Construction Programme for Multilayers 

Lifetronics - a Promising Area for Future Developments in which Dyconex AG are Active 

HSMtec - Modern Printed Circuit Board Technologies for High Current Loading and Heat-Sinking 

Dico Include PCBs in their Programme 

Printed Circuit Boards for Extreme Temperature Variations and Heavy Current Duty 

Universal Printed Circuit Board Test and Adapter System from Leitec GmbH 

MOS Electronic Improves Inner layer Registration Using their DIS System 

Packaging / Hybrid Technology

Opening of Fraunhofer IZM-ASSID Centre for 3-D System Integration at Wafer Level 

3-D Assembly and Interconnection Technology from Xenon 

Metallising Processes for 3D Integration in Microelectronics and Microsystem Technology 
 (Größe: 944 KB)

Substrates for High-Performance Electronics - Materials, Properties, Techniques, Reliability 

Cicor Technologies Group with RHe, Cicorel, Reinhardt and Photochemie 

Microelectronic Packaging Dresden GmbH 

JECA-Show 2010 with Countless Printed Circuit Board Innovations 

Printed Electronics Conference 

HiCoFlex® is now Really Thin 

Research & Technology

On the Application of Solder Balls for 3D Packaging 
(M. Nicák et al) 
 (Größe: 831 KB)

Vapour Phase Soldering Applications for PCB Assembling 
(P. Svasta et al) 
 (Größe: 106 KB)

Reliability Studies of Assemblies for the Automotive Industry 
(J. Trodler et al) 
 (Größe: 104 KB)

New Literature: Proceedings of the 2nd Landshut Microsystem Technology Conference 

Board Assembly Technologies

IPC International Conference on Reliability and Quality of Lead-Free Electronics Presents State-of-Art 

RoodMicrotec- Defect Analysis for High-Power LEDs 

2010 Rostock Soldering Technology Day: Focus on Low-Temperature Solders and Solar Technology 

New Software from GE for Sensing and Inspection Technologies 

Essentec - All-Round Service for Customers 

CK-Schablonetechnologie: Stencil Technology in the 3rd Dimension-Integrating Components of Different Height onto a PCB 

20 years of Standardised Test Innovation: IEEE1149.1 

Erni ES: More than Just a Plug 

AdoptSMT: Scoring with Replacement Parts 

World News at Fuji - and this as Double Pack 

ULT Expends its Range of Modular Exhaust Systems 

Seica’s Flying Probe can be Installed Anywhere 

Autofocus Inspection System from Jena 

Innovations at Werner Wirth Systems 

A New Stereo Microscope from Leica 

ASYS Announces Several New Highlights 

Forum

The Russian Electronics Industry has Great Potential 
(H. Poschmann) 

Smart Grids, a new Area of Technology brings Added-Value and Jobs to Austria 

Association News
(All Association News are only in German)

3-D MID-Informationen

DVS-Mitteilungen

FED-Informationen

VdL-Nachrichten

ZVEI-Mitteilungen

IMAPS-Mitteilungen